? semiconductor components industries, llc, 2006 march, 2006 ? rev. 1 1 publication order number: nuf9002fc/d nuf9002fc low capacitance 10 line emi filter with esd protection this device is a ten ? line emi filter array for wireless applications. greater than ? 25 db attenuation is obtained at frequencies from 900 mhz to 3.0 ghz. esd protection is provided across all capacitors. features ? emi filtering and esd protection ? integration of 50 discretes ? provides protection for iec61000 ? 4 ? 2 (level 4) ? 8.0 kv (contact) ? flip ? chip package ? moisture sensitivity level 1 ? esd rating: machine model = c; human body model = 3b ? pb ? free package is available* benefits ? reduces emi/rfi emissions on a data line ? integrated solution offers cost and space savings ? reduces parasitic inductances which offer a more ?ideal? low pass filter response ? integrated solution improves system reliability applications ? lcd for cell phones and pdas ? computers and printers ? communication systems ? mp3 players maximum ratings (t a = 25 c unless otherwise noted) rating symbol value unit esd discharge iec61000 ? 4 ? 2 contact discharge v pp 8.0 kv steady ? state power per resistor p r 100 mw steady ? state power per package p t 200 mw operating temperature range t op ? 40 to +85 c storage temperature range t stg ? 55 to +150 c junction temperature t j +125 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information nuf9002fct1 flip ? chip 3000 tape & reel marking diagram flip ? chip case 499g low ? pass filter input output r i/o = 100 c input = 28 pf nuf9002 ayww http://onsemi.com 1 234 5 d c b a e o1 o6 gnd in6 in1 o2 o7 gnd in7 in2 o3 o8 gnd in8 in3 o4 o9 gnd in9 in4 o5 o10 gnd in10 in5 pin configuration (ball side) ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. a1 ?? ?? ? chip (pb ? free) 3000 tape & reel (note: microdot may be in either location) nuf9002 = specific device code a = assembly location y = year ww = work week = pb ? free package
nuf9002fc http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol test conditions min typ max unit maximum reverse working voltage v rwm ? ? ? 5.0 v breakdown voltage v br i r = 1.0 ma 6.0 7.0 8.0 v leakage current i r v rm = 3.0 v ? ? 0.1 a series resistance r a ? 85 100 115 capacitance c line 1 f = 1.0 mhz, 0 vdc ? 28 35 pf cut ? off frequency f 3db (above this frequency, appreciable attenuation occurs) ? 110 ? mhz figure 1. insertion loss characteristics (s21 measurement) typical performance curve (t a = 25 c unless otherwise specified) figure 2. analog crosstalk curve (s41 measurement) figure 3. typical line capacitance vs. reverse bias voltage temperature ( c) resistance ( ) 90 92 94 96 98 100 102 104 106 108 110 ? 40 ? 20 0 20 60 80 40 figure 4. typical resistance over temperature reverse voltage (v) capacitance (pf) 0 5 10 15 012345 20 25 ? 45 ? 40 ? 35 ? 30 ? 25 ? 20 ? 15 ? 10 ? 5 0 frequency (hz) s21 (db) ? 70 ? 60 ? 50 ? 40 ? 30 ? 20 ? 10 0 frequency (hz) s41 (db) 1.e+06 1.e+07 1.e+08 1.e+09 1.e+10 1.e+07 1.e+08 1.e+09 1.e+10 30 35 channel 2, 3, 4, and 8 channel 6 or 10
nuf9002fc http://onsemi.com 3 printed circuit board recommendations parameter 500 m pitch 300 or 350 m solder ball pcb pad size 250 m +25 ? 0 pad shape round pad type nsmd solder mask opening 350 m 25 solder stencil thickness 125 m stencil aperture 250 x 250 m sq. solder flux ratio 50/50 solder paste type no clean type 3 or finer trace finish osp cu trace width 150 m max figure 5. nsmd vs. smd nsmd smd copper solder mask
nuf9002fc http://onsemi.com 4 package dimensions flip ? chip ? 25 csp case 499g ? 01 issue a seating plane 0.10 c 4 x ? ? a 0.05 b c 0.03 c 0.05 c 25 x b 12345 d c b a 0.10 c a a1 a2 c e d e d1 e1 e e side view top view bottom view notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. coplanarity applies to spherical crowns of solder balls. dim a min max ??? millimeters a1 a2 0.380 0.430 d 2.650 bsc e b 0.290 0.340 e 0.500 bsc d1 2.000 bsc e1 2.000 bsc 0.650 0.210 0.270 2.650 bsc on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2 ? 9 ? 1 kamimeguro, meguro ? ku, tokyo, japan 153 ? 0051 phone : 81 ? 3 ? 5773 ? 3850 nuf9002fc/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082 ? 1312 usa phone : 480 ? 829 ? 7710 or 800 ? 344 ? 3860 toll free usa/canada fax : 480 ? 829 ? 7709 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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